Mechanical properties of plasma polymer films controlled by RF power

Authors

  • Erik Palesch Institute of Materials Chemistry, Brno University of Technology, Czech Republic
  • Sona Kontarova Institute of Materials Chemistry, Brno University of Technology, Czech Republic
  • Vladimir Cech Institute of Materials Chemistry, Brno University of Technology, Czech Republic

DOI:

https://doi.org/10.3384/wcc2/60-63

Abstract

This study deals with plasma polymer films deposited on silicon substrates using tetravinylsilane monomer. The deposition technique was plasma-enhanced chemical vapour deposition. Nanoindentation was used as a method to investigate mechanical properties of samples prepared at different RF powers. The Young’s modulus and hardness of thin films were estimated from load-displacement curves. The nanoscratch test was employed to determine the critical normal load needed for film delamination, as a parameter describing adhesion to the substrate. AFM images of scratches were carried out to correlate the data with nature and shape of scratches.

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Published

2013-03-04

How to Cite

1.
Palesch E, Kontarova S, Cech V. Mechanical properties of plasma polymer films controlled by RF power. PSE [Internet]. 2013 Mar. 4 [cited 2021 Dec. 9];2(13):60-3. Available from: https://wcc.ep.liu.se/index.php/PSE/article/view/392