High Power Density Pulse Magnetron Sputtering - Process and Film Properties

Authors

  • Peter Frach Fraunhofer-Institut für Elektroenstrahl- und Plasmatechnik FEP, Germany
  • Christian Gottfried Fraunhofer-Institut für Elektroenstrahl- und Plasmatechnik FEP, Germany
  • Fred Fietzke Fraunhofer-Institut für Elektroenstrahl- und Plasmatechnik FEP, Germany
  • Heidrun Klostermann Fraunhofer-Institut für Elektroenstrahl- und Plasmatechnik FEP, Germany
  • Hagen Bartzsch Fraunhofer-Institut für Elektroenstrahl- und Plasmatechnik FEP, Germany
  • Daniel Gloess Fraunhofer-Institut für Elektroenstrahl- und Plasmatechnik FEP, Germany

DOI:

https://doi.org/10.3384/wcc2.80-83

Abstract

In this paper specific advantages and disadvantages of different pulse magnetron sputtering processes (unipolar and bipolar pulse sputtering at high and very high power density including HIPIMS) as well as current and potential fields of application will be discussed.

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Published

2013-03-04

How to Cite

1.
Frach P, Gottfried C, Fietzke F, Klostermann H, Bartzsch H, Gloess D. High Power Density Pulse Magnetron Sputtering - Process and Film Properties . PSE [Internet]. 2013 Mar. 4 [cited 2024 Nov. 21];2(13):80-3. Available from: https://wcc.ep.liu.se/index.php/PSE/article/view/397

Issue

Vol. 2 No. 13 (2012): 13th International Conference on Plasma Surface Engineering September 10 - 14, 2012, in Garmisch-Partenkirchen, Germany

Section

Session 12 - HiPIMS I