Sn Thin Film Deposition using a Hot Refractory Anode Vacuum Arc

Authors

  • I. I. Beilis Electrical Discharge and Plasma Laboratory, School of Electrical Engineering, Tel Aviv University, Israel
  • Y. Koulik Electrical Discharge and Plasma Laboratory, School of Electrical Engineering, Tel Aviv University, Israel
  • R. L. Boxman Electrical Discharge and Plasma Laboratory, School of Electrical Engineering, Tel Aviv University, Israel

DOI:

https://doi.org/10.3384/wcc2.231-234

Abstract

A Hot Refractory Anode Vacuum Arc (HRAVA) starts as cathodic arc, heating the anode and depositing on it cathode material. When the anode is hot, all deposited cathode material is reevaporated from the anode forming cleaner radially expanding plasma. It was shown that the rate of deposition reached 2-3 µm/min with significantly reduced macroparticle contamination in Sn films produced by HRAVA with current I=60–175 A and duration up to 180 s.

Downloads

Published

2013-03-04

How to Cite

1.
Beilis II, Koulik Y, Boxman RL. Sn Thin Film Deposition using a Hot Refractory Anode Vacuum Arc. PSE [Internet]. 2013 Mar. 4 [cited 2024 Nov. 21];2(13):231-4. Available from: https://wcc.ep.liu.se/index.php/PSE/article/view/437

Issue

Vol. 2 No. 13 (2012): 13th International Conference on Plasma Surface Engineering September 10 - 14, 2012, in Garmisch-Partenkirchen, Germany

Section

Poster: Physical vapour deposition